This equipment is a special equipment for the camera industry, and it is used for AOI detection of lens and lens of various sizes (mobile phones, tablets, etc.) camera modules (single camera, dual camera, multi-camera, etc.). Subsequent functions can be extended to security, vehicle and other fields.

Chip AOI appearance defect detection is designed to detect the photosensitive area, non-photosensitive area, gold wire area and other defects of the chip module.

For mobile phone, tablet, computer, vehicle camera module (single camera, dual camera, multi-camera and other front and rear camera finished products) and other 3C electronic devices polyhedron appearance detection.

In today's semiconductor manufacturing process, defect detection equipment is widely used, and the Feb factory uses this to confirm the yield rate and shipment quality inspection of each process link. In response to this market demand and combined with our technical accumulation, our company proposes a semiconductor inspection solution - patterned wafer defect inspection equipment, which is designed with EFEM+OM solution, which has higher flexibility and can meet the needs of various customers.

In today's semiconductor manufacturing process, defect detection equipment is widely used, and the Feb factory uses this to confirm the yield rate and shipment quality inspection of each process link. In response to this market demand and combined with our technical accumulation, our company proposes a semiconductor inspection solution - patterned wafer defect inspection equipment, which is designed with EFEM+OM solution, which has higher flexibility and can meet the needs of various customers.